Hered ZP3P-JT2 Series Vacuum Pads/Bellows Type
Overview
The Hered ZP3P-JT2 Series Vacuum Pads are specially engineered for the adsorption transfer of workpieces with soft, flexible packaging films. These innovative pads feature a unique design to minimize wrinkling and ensure gentle handling of delicate materials in various industrial applications.
Key Features
- Specialized Film Handling: Optimized for flexible soft film materials
- Unique Design: Thin film skirt and special shape ribs for wrinkle reduction
- Blue Color: Facilitates easy contamination inspection
- Vacuum Inlet Options: Male or female thread
- Bellows Type: 2.5-stage design for enhanced flexibility
Pad Specifications
| Series | Pad Form | Pad Diameters (mm) |
|---|---|---|
| ZP3P | Bellows (2.5-stage) | 20, 25, 32, 40, 50 |
Applications
- Flexible packaging handling
- Film transfer in manufacturing processes
- Delicate material handling in electronics industry
- Food packaging operations
- High-speed material transfer applications
Technical Advantages
- Wrinkle Reduction: Special design minimizes wrinkling of soft films
- Gentle Handling: Ideal for delicate and flexible materials
- Versatile Sizing: Multiple diameters to suit various material dimensions
- Quality Assurance: Blue color aids in visual inspection processes
Performance Highlights
- Material Integrity: Ensures minimal damage to soft, flexible films
- Operational Efficiency: Designed for high-speed transfer applications
- Adaptability: Suitable for a wide range of flexible packaging materials
- Precision: 2.5-stage bellows design for enhanced control and flexibility
The Hered ZP3P-JT2 Series Vacuum Pads/Bellows Type offer an advanced solution for industries requiring precise and gentle handling of flexible soft film materials. Their specialized design ensures optimal performance in packaging and transfer applications, minimizing wrinkles and improving efficiency. These pads are essential for manufacturers focusing on high-quality material handling in sensitive production processes, particularly in the packaging and electronics industries.
